TSMC is considering producing 3D DRAM at the request of NVIDIA

According to The Information, citing two informed sources, TSMC is considering expanding its business into advanced memory chip manufacturing and has recently begun to formulate plans for producing 3D DRAM at the request of its largest customer, NVIDIA. TSMC may build a new advanced memory chip factory and is also exploring the acquisition of existing factories to transform them into memory chip production bases, with the production timeline yet to be determined.

The plan is led by Vice President Hsu Kuo-Chin, who is responsible for TSMC's advanced packaging business. 3D DRAM uses a vertically stacked memory cell architecture instead of a single-layer horizontal arrangement to increase capacity. If TSMC enters the advanced memory chip field, it will compete with companies such as Samsung Electronics, SK Hynix, and Micron. TSMC and NVIDIA did not immediately respond to requests for comment.