Semiconductor front-end equipment manufacturer Bangxin Semiconductor has completed over 600 million yuan in Series B+ financing

According to the "Science and Technology Innovation Board Daily," Shanghai Bangxin Semiconductor Technology Co., Ltd. recently completed a B+ round of financing, with a total scale exceeding 600 million yuan. This round was led by Jiangxia Ke Investment Group, with follow-on investments from Bank of China Capital, Changjiang Venture Capital, and other institutions. The funds will mainly be used for the research and development of advanced process equipment, capacity construction, and the establishment of a delivery system in the Central China region.

Bangxin Semiconductor was established in 2020 and is headquartered in the Shanghai Lingang New Area. It mainly provides front-end process equipment such as etching, photoresist stripping, and thin film deposition for wafer manufacturing companies. The company's chairman, Wang Zhaoxiang, holds a Ph.D. in Physical Chemistry from the University of Science and Technology of China, and the core team comes from leading domestic semiconductor equipment companies. The company has entered the supply chain of leading domestic memory chip and wafer manufacturing enterprises, with multiple equipment validated by customers and achieving mass installation, with over 100 units expected to be delivered by 2025.

Jiangxia Ke Investment Group is also the project initiator for Bangxin's Wuhan project. On April 22 of this year, Bangxin's Central China production base located in the Jiangxia Intelligent Manufacturing Industrial Park in Wuhan commenced construction; on October 28, the first phase of this base officially went into production. The first phase covers an area of over 4,500 square meters and is responsible for assembly, testing, process validation, and delivery. After reaching full production capacity, it is planned to produce 100 semiconductor equipment units annually, with an annual output value of 600 million yuan. The Hubei Provincial Economic and Information Technology Department referred to this project as the first core equipment project for the front-end of the semiconductor industry chain in the Jiangxia District.